TAIFUN-CLEAN® COMPACT 110
Surface cleaning system for 3D components with ring ioniser, without suction
Key Facts
Compact cleaning system for integrating into new and existing plants
Non-contact cleaning with pulsating compressed air Great cleaning depth via special compressed air nozzles with beam bundling
For structured components and complex component geometries
TAIFUN-CLEAN COMPACT® 110 is perfectly adapted to the TAIFUN-CLEAN® rotating nozzle due to its round design. The symmetrical arrangement of the emitter tips creates uniform ion clouds.
- We offer several TAIFUN-CLEAN® COMPACT modules to facilitate the adaptation to complex shaped components
- Contactless cleaning protects the material surface
- Integrated ionisation to neutralise electrostatic surface charges
- Ionisation system contact-voltage proof for users
- Stable pressure-independent rev speed thanks to its patented, integrated control
- Option: Rev speed monitoring
- Additional variants available: CR, ESD
TCC110 TCC110CR TCC110ESD Standard Cleanroom optimised ESD applications Working width 100 mm 100 mm 100 mm Working distance (min. – max.) 20 - 50 mm 20 - 50 mm 20 - 50 mm Rotating nozzle type TCR-7A-070 TCR-7A-070-VA TCR-7A-070 Operating air pressure for cleaning system (recommended) 1.5 - 3.5 bar 1.5 - 3.5 bar 1.5 - 3.5 bar Operating air pressure for cleaning system (min. – max.) 1.0 - 5.0 bar 1.0 - 5.0 bar 1.0 - 5.0 bar Type compressed air connection for the cleaning system Ø 10 mm Ø 10 mm Ø 10 mm Type Ionisation 1x SR55-112 1x SR55-112 1× SIP-INT Ambient temperature (min. – max.) 5 – 50 °C 5 – 50 °C 5 – 50 °C Weight 1.1 kg 1.1 kg 1.3 kg Conveying direction (uni-/bi-/multidirectional) multidirectional multidirectional multidirectional Nl/min at operating pressure 1.0 bar 2.0 bar 3.5 bar TCC110 140 220 340 - Datasheet
- Datasheet