Double-sided cleaning of small components in the gripper
Application: small components, glass or plastic lenses in the gripper, cleaning after depaneling
Initial situation
During depaneling by means of sawing or milling, milling dust can be deposited on PCBs and possibly equipped, sensitive (optical) sensors, in spite of using a suction unit. These kinds of particles can lead to functional impairment. In order to assure a faultless performance of PCBs and sensors, residues from manufacturing processes must be corrected.
Solution
After depaneling, printed circuit boards equipped with sensors are guided by robot-guided grippers through the intended TAIFUN‑CLEAN® cleaning tunnel with a special air baffle. The combination of two TAIFUN‑CLEAN® units (including rotation nozzles and ionization electrodes) with optionally used static blowing nozzles neutralize electrostatic charges and loosen existing particles from circuit board and component surfaces. With the help of a special air guidance channel, the loosened particles are directed to the external suction unit via suction sockets.
![[English]](/fileadmin/_processed_/e/e/csm_KIST-ESCHERICH_TAIFUN-CLEAN_012_1_d0795dbd04.jpg)
