Cleaning of power modules and busbars after assembly
Applications: IGBT modules, ultrasonic-welded power contacts, copper terminals and busbars on DBC substrate (direct bonded copper), copper terminals on lead frame, cleaning of metallic materials such as copper, copper alloys, aluminium, converters, freque
Initial situation
High-performance electronic modules such as IGBTs are welded with ultrasound at the contact points. In battery production cell contacts is made by means of ultrasonic welding. When welding metals with ultrasound, metallic particles are formed. These can later lead to functional impairment (e.g., short-circuits or shortened creepage distances) up to a system failure of the modules.
Solution
After the ultrasonic welding process, the components are cleaned with the TAIFUN‑CLEAN® system and with additional cleaning elements adapted to the component geometry. The disrupting dust and foreign particles are removed from the surface using ionised pulsating compressed air and rotating nozzles and then taken up into a suction flow. The whirled-up contaminants are fed to the ESUC supply unit with integrated filter unit via suction ports and suction hoses. The integrated ionisation electrodes of type PRECISION are optimised for ESD applications and comply with the current IEC 61340-5-1:2016 standard, residual charge (ionic balance) < 35 V.
