Sealing an enclosure for electronics, actuator or sensor modules

Application: production of moisture- and dust-sensitive components

Initial situation

Electronics, actuator or sensor assemblies are installed in robust enclosures that are impervious to dust. The enclosures are often made of die-cast aluminium to achieve appropriate stability, adapted function and good heat dissipation. The cover plate required to close the enclosure is either glued on or screwed into the flange area. The required media impermeability is achieved by adding an area or ring seal to screwed connections, as needed. The supplementary material, the wide connecting flange and the effort required for installing the screws will increase the total weight and the total cost of the component. Adhesive bonding as an alternative to screwing the hybrid components is also costly and especially time-consuming.

Solution

When using a cover plate made of thermoplastic material, a moulded part for example, supplementary material such as screws or seals and adhesive are no longer required. In the hyJOIN® joining process, the plastic cover plate is connected to the die-cast aluminium enclosure using a localised heat application. The produced connection is resilient as soon as it is completed. The technology offers the possibility of fixing the cover plate to the housing on a spot, comparable to spot welding. A continuous, media-impermeable connection is also possible as an alternative. Since the joining process only takes a few seconds and can be monitored very well, it is particularly suitable for the automated assembly of components.

Technical consultancy